MICRO and NANOFABRICATION

AIM

This course introduces the theory and technology of micro/nano fabrication. Because of the interdisciplinary nature of the subject, its content includes concepts from many disciplines in engineering (electrical, materials, mechanical, chemical) and science. In this course, we will discuss the theory of basic processing techniques, such as diffusion, oxidation, photolithography, chemical vapor deposition, physical vapor deposition, etching, and metallization.

CONTENT

This course contains; ,Oxidation,Diffusion,Vacuum Systems,Chemical Vapor Diffusion,Sputtering,Evaporation,Lithography-II,Soft Lithography,Etching (wet),Etching (dry),Complementary metal-oxide-semiconductor (CMOS),Advanced Silicon Devices,Applications of Silicon Devices,Hot Topics in Micro and Nanofabrications-I,Hot topics in Micro and Nanofabrications-II.

1. 1

   Recognizes modern CMOS manufacturing technology, process integration and production flow diagrams

   Taught by: Discussion Method, Problem Solving Method, Self Study Method, Question - Answer Technique, Brainstorming Technique, Simulation Technique · Assessed by: Traditional Written Exam

2. 2

   Recognize the process modeling tools, device characterization and inspection techniques.

   Taught by: Problem Solving Method, Question - Answer Technique, Brainstorming Technique, Lecture Method · Assessed by: Traditional Written Exam

3. 3

   Compare the mask layouts, and understand the reasons for layout rules in VLSI design.

   Taught by: Problem Solving Method, Case Study Method, Brainstorming Technique · Assessed by: Traditional Written Exam

4. 4

   Identify the performance metrics for each unit process

   Taught by: Problem Solving Method, Question - Answer Technique, Brainstorming Technique, Lecture Method

5. 5

   Evaluates the fundamental theory and operation of equipments used in different microelectronic processes.

   Taught by: Problem Solving Method, Self Study Method, Brainstorming Technique, Lecture Method · Assessed by: Traditional Written Exam

6. 6

   Recognize the unit processes involved in IC fabrication, including diffusion, oxidation, ion implantation, lithography, dry/wet etching, physical and chemical vapor deposition techniques.

   Taught by: Problem Solving Method, Self Study Method, Brainstorming Technique, Simulation Technique, Lecture Method · Assessed by: Traditional Written Exam

WEEKLY PLAN

1. WEEK 0

2. WEEK 1

   Oxidation

3. WEEK 2

   Diffusion

4. WEEK 3

   Vacuum Systems

5. WEEK 4

   Chemical Vapor Diffusion

6. WEEK 5

   Sputtering

7. WEEK 6

   Evaporation

8. WEEK 7

   Lithography-II

9. WEEK 8

   Soft Lithography

10. WEEK 8

    Etching (wet)

11. WEEK 9

    Etching (dry)

12. WEEK 10

    Complementary metal-oxide-semiconductor (CMOS)

13. WEEK 11

    Advanced Silicon Devices

14. WEEK 12

    Applications of Silicon Devices

15. WEEK 13

    Hot Topics in Micro and Nanofabrications-I

16. WEEK 14

    Hot topics in Micro and Nanofabrications-II

ASSESSMENT

• Rate of Midterm Exam to Success30%
• Rate of Final Exam to Success70%

WORKLOAD

READING

• S.A. Campbell, The Science and Engineering of Microelectronic Fabrication, Oxford University Press //// R. C. Jaeger, Introduction to Microelectronic Fabrication //// J. D. Plummer, M. D. Deal and P. B. Griffin, Silicon VLSI Technology Fundamentals, Practice and Models, Prentice Hall, 2000.
• S. M. Sze, VLSI Technology, McGraw Hill

TEACHING STAFF

• Assoc.Prof. Hasan KURTCOORDINATOR